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Application of Ni and Cu nanoparticles in transient liquid phase (TLP) bonding of Ti-6Al-4V and Mg-AZ31 alloys
(
Springer US
, 2014 , Article)
The transient liquid phase (TLP) bonding of Ti-6Al-4V alloy to a Mg-AZ31 alloy was performed using an electrodeposited Ni coating containing a dispersion of Ni and Cu nanoparticles. Bond formation was attributed to two ...
Effect of Interlayer Thickness on Joint Formation Between Ti-6Al-4V and Mg-AZ31 Alloys
(
Springer New York LLC
, 2014 , Article)
The joining of a Ti-6Al-4V alloy to a Mg-AZ31 alloy was performed using Ni electroplated coatings during the TLP bonding process. In this work, different coating thicknesses were used ranging from 1 to 20 μm. The effect ...
TLP bonding of Ti-6Al-4V and Mg-AZ31 alloys using pure Ni electro-deposited coats
(
Elsevier B.V.
, 2014 , Article)
Transient liquid phase (TLP) bonding of Mg-AZ31 and Ti-6Al-4V alloys was performed using pure thin Ni electro-deposited coat interlayer (12 μm). The effect of bonding temperature, time and pressure on microstructural ...