TLP bonding of Ti-6Al-4V and Mg-AZ31 alloys using pure Ni electro-deposited coats
Author | Atieh, Anas M. |
Author | Khan, Tahir I. |
Available date | 2016-04-21T14:44:36Z |
Publication Date | 2014-12 |
Publication Name | Journal of Materials Processing Technology |
Resource | Scopus |
Identifier | http://dx.doi.org/10.1016/j.jmatprotec.2014.07.028 |
Citation | Atieh, A.M., Khan, T.I. "TLP bonding of Ti-6Al-4V and Mg-AZ31 alloys using pure Ni electro-deposited coats" (2014) Journal of Materials Processing Technology, 214 (12), pp. 3158-3168. |
ISSN | 0924-0136 |
Abstract | Transient liquid phase (TLP) bonding of Mg-AZ31 and Ti-6Al-4V alloys was performed using pure thin Ni electro-deposited coat interlayer (12 μm). The effect of bonding temperature, time and pressure on microstructural developments and subsequent mechanical properties across joint interface was studied at a temperature range from 500 to 540 °C, bonding time from 1 to 60 min and bonding pressure from 0 to 0.8 MPa. The mechanisms of bond formation varied across the joint region, with solid-state diffusion dominant at the Ti-6Al-4V interface and eutectic diffusion at the Mg-AZ31 interface. Joint microstructure was examined by scanning electron microscopy (SEM), and energy dispersive spectroscopy (EDS). X-ray diffraction (XRD) was used to detect the formation of intermetallic phases at the fracture surface. The maximum joint shear strength of 61 MPa was obtained at a temperature of 520 °C, 20 min and at a bonding pressure of 0.2 MPa. This joint strength was three times the bond strength reported for joints made using adhesives and represents 50% of the Mg-AZ31 alloy shear strength. |
Sponsor | The German Jordanian University (GJU), and NSERC Canada for the financial support for this research. |
Language | en |
Publisher | Elsevier B.V. |
Subject | Bonding pressure Bonding temperature Bonding time Mg-AZ31 alloy Microstructure Scanning electron microscopy (SEM) Ti-6Al-4V alloy |
Type | Article |
Pagination | 3158-3168 |
Issue Number | 12 |
Volume Number | 214 |
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