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AuthorAtieh, Anas M.
AuthorKhan, Tahir I.
Available date2016-05-16T10:55:24Z
Publication Date2014-11
Publication NameJournal of Materials Science
CitationAtieh, A.M., Khan, T.I. "Application of Ni and Cu nanoparticles in transient liquid phase (TLP) bonding of Ti-6Al-4V and Mg-AZ31 alloys" (2014) Journal of Materials Science, 49 (22), pp. 7648-7658.
ISSN0022-2461
URIhttp://dx.doi.org/10.1007/s10853-014-8473-z
URIhttp://hdl.handle.net/10576/4531
AbstractThe transient liquid phase (TLP) bonding of Ti-6Al-4V alloy to a Mg-AZ31 alloy was performed using an electrodeposited Ni coating containing a dispersion of Ni and Cu nanoparticles. Bond formation was attributed to two mechanisms; first, solid-state diffusion of Ni and Mg, followed by liquid eutectic formation at the Mg-AZ31 interface. Second, the solid-state diffusion of Ni and Ti at the Ti-6Al-4V interface resulted in a metallurgical joint. The joint interface was characterized by scanning electron microscopy, energy dispersive X-ray spectroscopy, and X-ray diffraction analysis. Microhardness and shear strength tests were used to investigate the mechanical properties of the bonds. The use of Cu nanoparticles as a dispersion produced the maximum joint shear strength of 69 MPa. This shear strength value corresponded to a 15 % enhancement in joint strength compared to TLP bonds made without the use of nanoparticles dispersion.
SponsorThe German Jordanian University (GJU), and NSERC Canada
Languageen
PublisherSpringer US
SubjectMaterials Science
SubjectCharacterization and evaluation of materials
SubjectPolymer sciences
SubjectContinuum mechanics
SubjectMechanics of materials
SubjectCrystallography
TitleApplication of Ni and Cu nanoparticles in transient liquid phase (TLP) bonding of Ti-6Al-4V and Mg-AZ31 alloys
TypeArticle
Pagination7648-7658
Issue Number22
Volume Number49


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