Show simple item record

AuthorAbaza M.A.
AuthorAl-Sulaiti L.
AuthorScattergood R.O.
AuthorYoussef K.M.
Available date2020-04-09T12:27:30Z
Publication Date2019
Publication NameAdvanced Engineering Materials
ResourceScopus
ISSN14381656
URIhttp://dx.doi.org/10.1002/adem.201800859
URIhttp://hdl.handle.net/10576/14025
AbstractNanocrystalline (nc) Cu and Cu–1% Nb bulk materials are synthesized using a combination of cryogenic and room temperature ball milling. The grain size values of these in situ consolidated Cu and Cu–1% Nb, determined using transmission electron microscopy, are found to be 22 nm and 18 nm, respectively. In this investigation, isochronal heat treatments are performed for 1 h to establish grain size and microstructural changes as a function of temperature. The annealing of nc Cu–1% Nb at a temperature of 1073 K reveals a slight increase in the average grain size from 18 to 45 nm. The grain size of nc Cu, however, increases from 22 nm to about 3 μm after annealing at the same conditions. The present results indicate that solute entrapment plays a major role in thermal stability of the high purity contaminant‐free Cu with the addition of only 1 at% Nb after annealing for 1 h up to a homologous temperature of 0.8. Kinetic stabilization via clustering of Nb atoms on the grain boundaries and the triple junctions is also observed after annealing at high temperature for longer times.
SponsorThis publication was made possible by the NPRP award number NPRP9-180-2-094 from the Qatar National Research Fund
Languageen
PublisherWiley-VCH Verlag
Subjectcopper
mechanical properties
nanocrystalline materials
niobium
thermal stability
TitleInfluence of 1%Nb Solute Addition on the Thermal Stability of In Situ Consolidated Nanocrystalline Cu
TypeArticle
Issue Number4
Volume Number21
dc.accessType Abstract Only


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following Collection(s)

Show simple item record