تصفح حسب المؤلف "Atieh, Anas M."
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Application of Ni and Cu nanoparticles in transient liquid phase (TLP) bonding of Ti-6Al-4V and Mg-AZ31 alloys
Atieh, Anas M.; Khan, Tahir I. ( Springer US , 2014 , Article)The transient liquid phase (TLP) bonding of Ti-6Al-4V alloy to a Mg-AZ31 alloy was performed using an electrodeposited Ni coating containing a dispersion of Ni and Cu nanoparticles. Bond formation was attributed to two ... -
Effect of Interlayer Thickness on Joint Formation Between Ti-6Al-4V and Mg-AZ31 Alloys
Atieh, Anas M.; Khan, Tahir I. ( Springer New York LLC , 2014 , Article)The joining of a Ti-6Al-4V alloy to a Mg-AZ31 alloy was performed using Ni electroplated coatings during the TLP bonding process. In this work, different coating thicknesses were used ranging from 1 to 20 μm. The effect ... -
TLP bonding of Ti-6Al-4V and Mg-AZ31 alloys using pure Ni electro-deposited coats
Atieh, Anas M.; Khan, Tahir I. ( Elsevier B.V. , 2014 , Article)Transient liquid phase (TLP) bonding of Mg-AZ31 and Ti-6Al-4V alloys was performed using pure thin Ni electro-deposited coat interlayer (12 μm). The effect of bonding temperature, time and pressure on microstructural ...