Influence of 1%Nb Solute Addition on the Thermal Stability of In Situ Consolidated Nanocrystalline Cu

Abstract

Nanocrystalline (nc) Cu and Cu–1% Nb bulk materials are synthesized using a combination of cryogenic and room temperature ball milling. The grain size values of these in situ consolidated Cu and Cu–1% Nb, determined using transmission electron microscopy, are found to be 22 nm and 18 nm, respectively. In this investigation, isochronal heat treatments are performed for 1 h to establish grain size and microstructural changes as a function of temperature. The annealing of nc Cu–1% Nb at a temperature of 1073 K reveals a slight increase in the average grain size from 18 to 45 nm. The grain size of nc Cu, however, increases from 22 nm to about 3 μm after annealing at the same conditions. The present results indicate that solute entrapment plays a major role in thermal stability of the high purity contaminant‐free Cu with the addition of only 1 at% Nb after annealing for 1 h up to a homologous temperature of 0.8. Kinetic stabilization via clustering of Nb atoms on the grain boundaries and the triple junctions is also observed after annealing at high temperature for longer times.