Application of Ni and Cu nanoparticles in transient liquid phase (TLP) bonding of Ti-6Al-4V and Mg-AZ31 alloys
Author | Atieh, Anas M. |
Author | Khan, Tahir I. |
Available date | 2016-05-16T10:55:24Z |
Publication Date | 2014-11 |
Publication Name | Journal of Materials Science |
Resource | Scopus |
Citation | Atieh, A.M., Khan, T.I. "Application of Ni and Cu nanoparticles in transient liquid phase (TLP) bonding of Ti-6Al-4V and Mg-AZ31 alloys" (2014) Journal of Materials Science, 49 (22), pp. 7648-7658. |
ISSN | 0022-2461 |
Abstract | The transient liquid phase (TLP) bonding of Ti-6Al-4V alloy to a Mg-AZ31 alloy was performed using an electrodeposited Ni coating containing a dispersion of Ni and Cu nanoparticles. Bond formation was attributed to two mechanisms; first, solid-state diffusion of Ni and Mg, followed by liquid eutectic formation at the Mg-AZ31 interface. Second, the solid-state diffusion of Ni and Ti at the Ti-6Al-4V interface resulted in a metallurgical joint. The joint interface was characterized by scanning electron microscopy, energy dispersive X-ray spectroscopy, and X-ray diffraction analysis. Microhardness and shear strength tests were used to investigate the mechanical properties of the bonds. The use of Cu nanoparticles as a dispersion produced the maximum joint shear strength of 69 MPa. This shear strength value corresponded to a 15 % enhancement in joint strength compared to TLP bonds made without the use of nanoparticles dispersion. |
Sponsor | The German Jordanian University (GJU), and NSERC Canada |
Language | en |
Publisher | Springer US |
Subject | Materials Science Characterization and evaluation of materials Polymer sciences Continuum mechanics Mechanics of materials Crystallography |
Type | Article |
Pagination | 7648-7658 |
Issue Number | 22 |
Volume Number | 49 |
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Mechanical & Industrial Engineering [1339 items ]