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    Preparation and Preliminary Dielectric Characterization of Structured C60-Thiol-Ene Polymer Nanocomposites Assembled Using the Thiol-Ene Click Reaction

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    Preparation and Preliminary Dielectric Characterization of Structured C60-Thiol-Ene Polymer Nanocomposites Assembled Using the Thiol-Ene Click Reaction.pdf (1.733Mb)
    Date
    2015-01-01
    Author
    Ahmed, Hanaa M.
    Windham, Amber D.
    Al-Ejji, Maryam M.
    Al-Qahtani, Noora H.
    Hassan, Mohammad K.
    Mauritz, Kenneth A.
    Buchanan, Randy K.
    Buchanan, J. Paige
    ...show more authors ...show less authors
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    Abstract
    Fullerene-containing materials have the ability to store and release electrical energy. Therefore, fullerenes may ultimately find use in high-voltage equipment devices or as super capacitors for high electric energy storage due to this ease of manipulating their excellent dielectric properties and their high volume resistivity. A series of structured fullerene (C60) polymer nanocomposites were assembled using the thiol-ene click reaction, between alkyl thiols and allyl functionalized C60 derivatives. The resulting high-density C60-urethane-thiol-ene (C60-Thiol-Ene) networks possessed excellent mechanical properties. These novel networks were characterized using standard techniques, including infrared spectroscopy (FTIR), differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), and thermal gravimetric analysis (TGA). The dielectric spectra for the prepared samples were determined over a broad frequency range at room temperature using a broadband dielectric spectrometer and a semiconductor characterization system. The changes in thermo-mechanical and electrical properties of these novel fullerene-thiol-ene composite films were measured as a function of the C60 content, and samples characterized by high dielectric permittivity and low dielectric loss were produced. In this process, variations in chemical composition of the networks were correlated to performance characteristics.
    URI
    https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84949682039&origin=inward
    DOI/handle
    http://dx.doi.org/10.3390/ma8115424
    http://hdl.handle.net/10576/48953
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