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    Oxide derived Cu nanofibril assembly for enhanced nonenzymatic glucose sensing

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    1-s2.0-S2352492823009777-main.pdf (3.618Mb)
    Date
    2023-06-01
    Author
    Muchharla, Baleeswaraiah
    Barbee, Brianna
    Darby, Marlon
    Cao, Wei
    Elsayed–Ali, Hani
    Sadasivuni, Kishor Kumar
    Adedeji, Adetayo
    Kumar, Kapil
    Karoui, Abdennaceur
    Panwar, Preety
    Slaughter, Gymama
    Kumar, Bijandra
    ...show more authors ...show less authors
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    Abstract
    In this report, we have prepared copper nanofibril assembly via thermal oxidation followed by electrochemical reduction processes, exhibiting superior glucose detection ability. The morphological analysis evidenced the formation of rough islands or nanofibril structure on the Cu surface depending on initial thermal oxidation temperature. The glucose detection performance was investigated by performing cyclic voltammetry and chronoamperometry with varying glucose concentration. A high sensitivity (4131.57 μA mM−1 cm−2), low detection limit (1.41 μM), wider linear range (0–3.9 mM) and long–term stability (30 days) have been recorded for electrode thermally oxidized at 400 °C followed by electrochemical reduction process (rCu_400). The sensitivity is almost three times higher in comparison to the planner Cu surface. This significantly enhanced glucose sensing ability rCu_400 has been attributed to the nanofibril morphology, origination of Cu (111) facet and formation of a stable oxide layer evidenced by scanning electron microscopy, X-ray diffraction and energy dispersive spectroscopy analysis. Despite higher sensitivity, rCu_400 electrode does not show any response to the chloride ion, dopamine, ascorbic acid and uric acid. These results indicate that the Cu nanofibril structure prepared via simple oxidation/reduction process can be an excellent candidate to be used as an electrode for glucose sensing application.
    URI
    https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85160201670&origin=inward
    DOI/handle
    http://dx.doi.org/10.1016/j.mtcomm.2023.106286
    http://hdl.handle.net/10576/62667
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